Die attach
Conductive or structural attachment of bare die to lead frames, substrates or thermal paths.
Package materials integration
Connect the die.
Protect the package.
Material directions for die attach, capillary underfill, thermal management, fine-pitch protection and package sealing, selected around geometry, process window and the required reliability level.
Application scope
Different package interfaces need different material functions.
A single package may require electrical connection, mechanical reinforcement, heat transfer and environmental protection. Each joint is evaluated within the complete process flow.
Flip chip, BGA and CSP
Capillary underfill to redistribute stress and reinforce solder interconnects.
MEMS and sensors
Controlled attachment and protection for compact devices with process-sensitive structures.
Power devices
Bonding and thermal-interface routes for assemblies with concentrated heat and wider temperature cycles.
COF and driver connections
Fine-pitch lead protection with controlled flow, purity and low ionic-content requirements.
High-density modules
Reinforcement, thermal management and sealing for integrated computing, sensing and communications packages.
The package is a material system
Die attach, underfill, thermal interface and encapsulation materials interact through cure temperature, stress, contamination control and production sequence. Selection should consider the complete assembly rather than each material in isolation.
Key challenges
Balance processability with long-term reliability.
Qualification should connect measurable material behavior to the actual package geometry, surfaces and production equipment.
CTE and warpage
Manage thermomechanical stress across silicon, metals, solder and organic substrates.
Flow and voids
Fill fine gaps and protect leads without trapping air or contaminating forbidden areas.
Bond-line control
Maintain deposition, placement and final thickness for stable electrical and thermal paths.
Heat transfer
Reduce interface resistance while accommodating assembly tolerances and operating movement.
Purity and moisture
Control ionic contamination, moisture exposure and interfacial degradation.
Process compatibility
Match cure, reflow, handling and inspection to the component’s thermal budget and takt.
Material platform map
Build the package route by function.
The available platforms provide starting points. Final grade selection requires evaluation on the actual die, substrate, geometry, equipment and reliability plan.
Capillary underfill
Fast gap penetration and low-CTE, high-Tg reinforcement directions for solder-interconnect protection.
View underfill platforms →Conductive die attach
Silver-filled bonding routes for electrical connection, controlled placement and mechanical attachment.
View conductive silver platforms →Thermal interfaces
Thermal gels, adhesives and coatings for processors, power devices and heat-spreading structures.
View thermal platforms →Fine-pitch encapsulation
High-purity, low-ionic material directions for COF leads and other fine-pitch protective structures.
View COF encapsulation platforms →Evaluation route
Qualify the material inside the real package process.
Coupon data supports screening. Package-level reliability confirms whether flow, cure, interfaces and stresses work together.
Define geometry
Confirm die size, stand-off, metallization, bond-line target, flow path and keep-out areas.
Set the process
Establish dispense, preheat, placement, cure, reflow and inspection windows.
Inspect the interfaces
Check spread, voids, fillets, wetting, cure completeness and electrical or thermal contact.
Run reliability
Verify performance after moisture exposure, thermal cycling, reflow and mechanical loading as required.
Evaluation framework
Measure the joint, package and process together.
Published or confirmed grade data defines the starting point. Customer-side package trials determine fitness for production.
- Viscosity and dispense stability
- Flow time and void inspection
- Bond-line thickness
- Adhesion or die shear
- Electrical contact resistance
- Thermal resistance
- Tg and CTE direction
- Cure and reflow compatibility
- Moisture exposure
- Thermal cycling and mechanical shock
Start with the package
Share your geometry, process and failure target.
We can map the required material functions and define a practical evaluation sequence.
Discuss your package ↗